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 PRODUCT INFORMATION
Vol.51
Support for 2-million gate devices using a Sanyo-developed 3-metal layer technology Orders for 0.35-m ASICs Now Accepted
LC24000, LC27200 Series
Overview
In 1992, SANYO entered a technology sharing partnership for ASIC products with ASPEC Technology, Inc. (USA). The HDA (high-density architecture) technology resulting from that partnership achieves a 30% improvement in integration density over previous SANYO technology and the excellent cost-performance ratio provided by the HDA design rules have been well-received in the market. Thus SANYO ASSP and ASIC business has been growing briskly. We have entered a new technology agreement concerning 0.35- and 0.25-m ASICs and we are now accepting orders for the LC24000 Series (0.35-m gate arrays) and the LC27200 Series (0.35-m embedded arrays) products. Also, by inheriting earlier technologies, we can provide even faster megacells in analog/digital hybrid ASICs and can respond to our customers' diversifying needs. These new ASIC series can contribute to the efficient implementation of superlative cost-performance ratio ICs for application areas that require larger scale circuits and improved speed. Application areas that can benefit from these ASIC series include office equipment, personal computer peripherals, portable equipment, and other information/communication areas as well as consumer products such as digital still cameras and digital TV and VCRs. Furthermore, in addition to our existent CAD tool support system for achieving large-scale designs, we have adopted several new tools, including a static timing analysis tool (Motive*1), a test design that provides increased user choices in test design procedures, an accelerator tool that achieves increased speeds in logic design and an ECO that supports precise layout corrections. Thus we provide an environment in which design is even easier than before. In particular, this environment adopts both the AWE algorithm as a procedure for achieving high-precision delay calculations and local scaling factors with a wide variety of variation coefficients. These series also provide a full complement of personal computer interface macros, including IrDA, USB, ATAPI, SCSI, and IEEE 1394. SANYO began accepting orders for these 0.35-m ASIC series in November 1997, and plans to begin accepting orders for 0.25-m ASICs in the later half of 1998. Note: 1. Motive is a registered trademark of Viewlogic Systems, Inc.
SANYO Electric Co., Ltd. Semiconductor Business Headquarters Overseas Marketing Division
TOKYO OFFICE: Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110 JAPAN 1
PRODUCT INFORMATION
Features
* Support for 2-million gate devices using a SANYO-developed 0.35-m 3-metal layer technology. * These 0.35-m ASICs can interface with either 3.3-V or 5-V external signals without the use of any special external circuits even in a system where both 3.3-V and 5-V circuits are combined on the same board . * An extensive lineup of megacells supports the development of large-scale system ICs. * Our customers custom circuits and ASSPs designed using ASIC techniques can be integrated on a single chip. * Power dissipation can be estimated precisely at simulation time using power simulator "A Power". Power dissipation is estimated precisely by referencing a library of current drain values that depend on the load capacitance and individual cell waveform distortions based on the Verilog*2 simulation file. * The adoption of Quick Port, which is an inter-ASIC transplant tool that adopts the HDA concept, allows data migration between ASPEC libraries to be performed easily in the layout database. While it goes without saying that data migration can be performed easily in the layout database for data from the same vendor, this system also supports data migration between data from different vendors. * FPGA designs can be easily converted to these ASIC products. * Full scan is supported for test design. * A high-level language (RTL) interface is supported. Note: 2. Verilog is a registered trademark of Cadence Design Systems, Inc.
Specifications
* 0.35-m 3-metal layer gate arrays Maximum number of gate devices incorporated: 2,000,000 Maximum number of gate devices usable: 1,400,000 Delay time: 100 ps (power gate, standard load) Power supply voltage: 3.3V * 0.35-m 3-metal layer embedded arrays CPU core 8 bits 65C02S 16 bits 65C816 32-bit RISC Original CPU peripheral 82CXX Series Memory SRAM (single, dual), DRAM, Line memory, FIFO, and ROM Analog blocks 6-, 8-, 10-bit A/D converters, 6-, 8-, 10-bit D/A converters, operational amplifiers, LCD drivers, and PLL PC interfaces USB, ATAPI, SCSI, PCMCIA, IrDA, and IEEE1394 (under development)
SANYO Electric Co., Ltd. Semiconductor Business Headquarters Overseas Marketing Division
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PRODUCT INFORMATION
Sample Availability
Samples of the LC24000, LC27200 Series are available in November 1997.
NOVEMBER7, 1997
s No products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster/crime-prevention equipment and the like, the failure of which may directly or indirectly cause injury, death or property loss. s Anyone purchasing any products described or contained herein for an above-mentioned use shall: Accept full responsibility and indemnify and defend SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors and all their officers and employees, jointly and severally, against any and all claims and litigation and all damages, cost and expenses associated with such use: Not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on SANYO ELECTRIC CO., LTD., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. s Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. SANYO believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.
SANYO Electric Co., Ltd. Semiconductor Business Headquarters Overseas Marketing Division
11498/51
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